A glass uniform thickness inspection machine, combining high-precision inspection experience and the manufacturing process of mobile phone glass. The wafer is fed to the predetermined position via a conveyor belt, and the robotic arm picks it up onto the fixture. After the fixture is transferred, it is positioned by a cylinder. After passing through sensor inspection and data storage, the robotic arm collects and removes the wafer. This 3D model is designed in Solidworks 2015 source file + STP shared.
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![Automatic Packing Machine [In Mass Production]](https://mecw.b-cdn.net/image/2025/A012501000739-1.png)
