Chip Pick-Up Test Equipment (With PPT Equipment Process Explanation)

The chipset uses two sets of trays for continuous non-stop feeding, with a 3-axis XYZ module equipped with a bidirectional pitch-adjusting module to adsorb the product. After pitch adjustment, it is placed into the testing group for inspection, automatically sorting OK/NG. Chipset Grabbing and Testing Equipment (including PPT equipment process explanation) Operation Overview: 1. Manually place the circuit board, guide and position the inner cavity; 2. Manually place two sets of chip trays; 3. After photoelectric detection indicates material loading is in place, the equipment prepares itself, and the manual button starts the equipment; 4. Release downward pressing plate moves to avoid position. The suction nozzle changes pitch and moves to the tray to pick up the materials. After pitch adjustment, it is pressed into the circuit board; 5. Notification for material unloading and replacement; 6. Remove the empty tray and insert a new material tray. The device remembers the quantity location of the other tray; 7. The release position can select every two rows individually;