Wafer Lift Mechanism: The wafer is supplied by a basket, which needs to be lifted and indexed on the supply module for operations of inserting and removing individual wafers from the basket.
Wafer Transfer Mechanism: The wafer is taken out from the basket by a wafer transfer mechanism and sent to the wafer workstation for chip picking operations. Once all chip picking is completed, the wafer is transferred back to the basket by the transfer mechanism for replacement.
This module is a common standard module in Die Bonders or semiconductor equipment. It includes the stp version, welcome to download!
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