Platform upgraded. Please re-register to continue accessing our community! Sign Up Now >

Semiconductor Fully Automatic Taping Machine

Semiconductor Fully Automatic Taping Machine
Premium
Full-automatic Taping Machine 3D Model This is a taping packaging device for semiconductors. The design principle is to adopt a 45-degree gravity slide method to allow products in the material tube to naturally flow down from the tube. In the middle, an air blowing feature is added to prevent jamming. The taping packaging is completed by a 45-degree pick-and-place robotic arm, which has a very fast pick-and-place speed. In the middle, you can see a CCD vision camera detecting.

Premium download

Subscribe to access all premium projects, a good reference data source for your engineering design.

Subscribe to download
57.2K Views
47.5K Downloads

neha.vandervort's items

Similar items

We use cookies to personalize your experience. By continuing to visit this website you agree to our use of cookies

More