This is the main movement mechanism of an IC bonding machine. The principle is bonding the IC onto the glass, and the fully automatic bonding machine is used for mass production. Once you have the machine properly debugged, it is very stable. We currently have many types of automatic bonding machines, but the principles are the same. First, the glass is lifted from the conveyor belt, then placed on the ACF platform for alignment, and ACF is pressed. Then the pre-press arm lifts the glass and places it on the pre-press platform for pre-pressing the IC. Finally, it is placed on the main press platform for final pressing.
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