Wafer Lift Mechanism: The wafer is supplied by a basket, which needs to be lifted and indexed on the supply module for operations of inserting and removing individual wafers from the basket. _x000D_
Wafer Transfer Mechanism: The wafer is taken out from the basket by a wafer transfer mechanism and sent to the wafer workstation for chip picking operations. Once all chip picking is completed, the wafer is transferred back to the basket by the transfer mechanism for replacement. _x000D_
This module is a common standard module in Die Bonders or semiconductor equipment. It includes the stp version, welcome to download!
There are no reviews yet.