Semiconductor Packaging Equipment Db Discharge Module
Magazine Discharge Module: After the chip bonding on the lead frame or substrate is completed, it is sent to the magazine discharge module via the transmission mechanism for storage and neatly stacked in the magazine. Once the magazine is full, it can automatically replace it with an empty magazine. This module is a commonly used standard module in Die Bonder or semiconductor equipment. It includes the STP version. Welcome to download!
Specification: Semiconductor Packaging Equipment Db Discharge Module
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