Semiconductor Fully Automatic Taping Machine

Full-automatic Taping Machine 3D Model
This is a taping packaging device for semiconductors. The design principle is to adopt a 45-degree gravity slide method to allow products in the material tube to naturally flow down from the tube. In the middle, an air blowing feature is added to prevent jamming. The taping packaging is completed by a 45-degree pick-and-place robotic arm, which has a very fast pick-and-place speed. In the middle, you can see a CCD vision camera detecting.