Led Die Bonder Substrate Supply and Distribution Mechanism
This structure is the substrate feeding and distributing mechanism in an LED die-bonding machine. Manually place the stacked substrates in the substrate placement area. The Z-axis lifting mechanism rises, the gripper mechanism picks the substrate, and the cylinder transfers the gripper for two-station refilling and distributing. This mechanism has been verified as stable and reliable, and includes stp format, so feel free to download!
Specification: Led Die Bonder Substrate Supply and Distribution Mechanism
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