Chip Component Carrier Tape Packaging Machine After High-Temperature Testing

3D model of carrier tape packaging machine for SMD components after high-temperature testing designed with SolidWorks 2014, Sldprt and Sldasm source files + STEP universal files provided. Directly load SMD components into carrier tapes after testing and onto the SMT machine. This machine can simultaneously test multiple components. The device is abbreviated as: high-temperature test packaging machine. After decompression, it’s over 120M, and the structure is relatively complete. It is a good model for learning and research. Welcome everyone to download.