Automatic Loading and Unloading Mechanism for Led Die Bonder Substrate

This structure is an automated substrate loading and unloading mechanism in an LED die bonder machine. It can specifically collect substrates with bonded dies and can also be equipped with an additional set of cylinder ejector mechanisms for feeding and collecting substrates. This mechanism has dual stations, ensuring that magazine changes do not require stopping the machine. This mechanism has been verified to be stable and reliable, and it includes a .stp format file, available for download with confidence!