LED Die Bonder Placement Machine Semiconductor Substrate Gripper Mechanism
This mechanism is commonly used in LED die bonding machines & chip mounters for substrate gripping and placement. The gripping jaws work with extension springs to enable slight gripping and placement of substrates without causing deformation. This mechanism has been verified to be stable and reliable, and it includes an stp format, so you can download it with confidence!
Specification: LED Die Bonder Placement Machine Semiconductor Substrate Gripper Mechanism
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