This structure is the substrate feeding and distributing mechanism in an LED die-bonding machine. Manually place the stacked substrates in the substrate placement area. The Z-axis lifting mechanism rises, the gripper mechanism picks the substrate, and the cylinder transfers the gripper for two-station refilling and distributing. This mechanism has been verified as stable and reliable, and includes stp format, so feel free to download!
Specification: Led Die Bonder Substrate Supply and Distribution Mechanism
|
User Reviews
Be the first to review “Led Die Bonder Substrate Supply and Distribution Mechanism”
Led Die Bonder Substrate Supply and Distribution Mechanism
There are no reviews yet.